Electromigration of bivalent functional groups on graphene

Adsorbate transport on graphene by electromigration.

Chemical functionalization of graphene holds promise for various applications ranging from nanoelectronics to catalysis, drug delivery, and nanoassembly. In many applications it is important to be able to transport adsorbates on graphene in real time. We propose to use electromigration to drive the adsorbate transport across the graphene sheet. To assess the efficiency of electromigration, we d...

the effect of functional/notional approach on the proficiency level of efl learners and its evaluation through functional test

in fact, this study focused on the following questions: 1. is there any difference between the effect of functional/notional approach and the structural approaches to language teaching on the proficiency test of efl learners? 2. can a rather innovative language test referred to as "functional test" ge devised so so to measure the proficiency test of efl learners, and thus be as much reliable an...

Direct mechanochemical cleavage of functional groups from graphene.

Mechanical stress can drive chemical reactions and is unique in that the reaction product can depend on both the magnitude and the direction of the applied force. Indeed, this directionality can drive chemical reactions impossible through conventional means. However, unlike heat- or pressure-driven reactions, mechanical stress is rarely applied isometrically, obscuring how mechanical inputs rel...

DFT studies on the heterogeneous oxidation of SO2 by oxygen functional groups on graphene.

The heterogeneous oxidation of SO2 has been the subject of intense scrutiny in atmospheric chemistry because of the adverse effects of sulfate particles. Although it has been found that the soot particles with a graphene-like structure play an important role in the oxidation of SO2, little is known about the atomic-level mechanism involved. Here, we studied the oxidation of SO2 on oxygen-functi...

Effect of Reduced Graphene Oxide Cap Layer on Electromigration Reliability of Cu Interconnect